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[Analysis Case] Evaluation of Adhesive Tape Residue

We will identify the surface adsorbate components using TOF-SIMS.

Residue from adhesive tape can cause poor adhesion and peeling during the manufacturing process. When residue is suspected to be the cause of defects, TOF-SIMS, which can analyze the composition and distribution of surface contaminants, is effective. We will present a case where the surface of a silicon wafer was adhered with adhesive tape and measured with TOF-SIMS after peeling it off.